TN6000T Ultra High Speed Pallet Fully Automatic Burning Machine
TN6000T is a high-speed programming device designed for packaging chips in pallets. It uses precision linear motor drive technology to take out the chips from the feeder, move them to the test site, and package them into prototypes based on the test results, with high reliability. The suction and release action and reliable processing mechanism make it play an excellent level in batch programming.
TN6000T is a high-speed burning device designed for chip packaging in trays. It uses precision linear motor drive technology to take out the chips from the feeder, move them to the test site, and package them into prototypes based on the test results, with high reliability. The suction and release action and reliable processing mechanism make it play an excellent level in batch programming.
Features:
4 suction nozzles for efficient handling,
dual-core control system, excellent computing speed, precision magnetic levitation motor, minimal noise interference,
million-level dust-free drag chain, high-reliability connection with mobile terminal actuators, dedicated high-speed feeding, and feeder
friendly people Machine operation interface, better presentation of production status information
- Introduction
- Specification
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Basic parameters Model: TN6000T
Size: 1350mm(W)*750mm(D)*1360mm(H)
Net weight: 300kg
Energy consumption: power supply single-phase AC220V, 50HZ/1.2kw
air source>0.6Mpa dry compressed
air compressed air flow>120L/minEquipment performance Maximum speed: 4000±100@TT=12ses (16 stations)
Standard 4 nozzles: &16 station
line change cycle: <15min
failure rate: <1/2000
feeding bin capacity: ≥20 trays
out bin holding Quantity: ≥20 trays
NG storage method: NG boxoperating system Control mode: self-developed industrial control board equipped with 7-inch touch screen.
Communication mode: TTL, RS232, RS485.
Comprehensive exception handling mechanism.
Menu interface switching.
Manual single-step burning test function.
Complete production data statistics.
Anti-overlapping confirmation mechanism.
Recipe management, one-time Can be called repeatedly after the project is setProcessing capacity Applicable material tray: JEDEC standard
package form: SOP QFN BGA QFP
package size: 2x2mm to 30x30mm
test board size: 38mm*56mm
test board maximum size: 76mm*150mm
other The base
carrier tape tension detection can be customized according to the customer's test board
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0755-23305816
18938645660(Technical)
18682404802(Sales)
415-418, Building B, Haohe Zhichuang, No. 10, Fuyuan 2nd Road, Fuyong street, Bao'an District, Shenzhen
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