TN6000P Ultra High Speed Taping Burner
TN6000P is a high-speed programming device designed for taping and packaging chips. It uses precision linear motor drive technology to take out the chips from the feeder, move them to the test site, and package them into prototypes based on the test results. High trust The high suction and release action and reliable processing mechanism make it play an excellent level in batch programming.
TN6000P is a high-speed programming device designed for taping and packaging chips. It uses precision linear motor drive technology to take out the chips from the feeder, move them to the test site, and package them into prototypes based on the test results. High trust The high suction and release action and reliable processing mechanism make it play an excellent level in batch programming.
Features:
4 nozzles for efficient handling
Dual-core control system, excellent calculation speed, precision magnetic levitation motor, minimum noise interference
Million-level dust-free drag chain, high-reliability connection mobile terminal actuator dedicated high-speed feeding feeder
Friendly man-machine interface, better presentation of production status information
- Introduction
- Specification
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Basic parameters Model TN6000P
Size 1350mm(W)*750mm(D)*1360mm(H)
Net weight 300kg
Energy consumption power supply Single-phase AC220V, 50HZ/1.2kw
air source>0.6Mpa dry compressed
air compressed air flow rate>120L/minEquipment performance Maximum speed 4000±100@TT=12ses (16 stations)
Standard 4 suction nozzles & 16 stations
line change cycle <15min
failure rate <1/2000
one reel can be loaded at a time
NG storage method NG boxoperating system Control method: Self-developed industrial control board is equipped with a 7-inch touch screen.
Communication methods. TTL, RS232, RS485.
All-round exception handling mechanism.
Menu interface switch.
Manual single-step burning test function.
Complete production data statistics.
Anti-overlapping confirmation mechanism.
Recipe management, one-time project Can be called repeatedly after settingProcessing capacity Suitable for tape and reel packaging chip burning
package form SOP QFN BGA QFP
package size 2x2mm to 30x30mm
test board size 38mm*56mm
test board maximum size 76mm*150mmother The base
carrier tape tension detection can be customized according to the customer's test board
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0755-23305816
18938645660(Technical)
18682404802(Sales)
415-418, Building B, Haohe Zhichuang, No. 10, Fuyuan 2nd Road, Fuyong street, Bao'an District, Shenzhen
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